Description
Edition details
- Author / contributors: John Lau; Xuejun Fan
- Publisher: Springer Nature Singapore
- Publication date: May 18, 2025
- Language: English
- ISBNs: 9789819641659; 9789819641666
- Digital formats: PDF
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
€ 212,49
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. An English-language digital edition by John Lau; Xuejun Fan, available in PDF.
Download format: PDF (.pdf). Available files can be downloaded from My books immediately after payment is confirmed. We also email you a download link. If your edition needs file preparation, your account shows its pending status; the download and email follow upload and staff approval.
Additional information
| Author | John Lau; Xuejun Fan |
|---|---|
| Publisher | Springer Nature Singapore |
| Language | English |
| ISBN | 9789819641659, 9789819641666 |
| Format | |
| Publication date | May 18, 2025 |
| DRM | DRM-free edition available |
| Download format | PDF (.pdf) |
Reviews
There are no reviews yet.