€ 212,49
Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration. An English-language digital edition by John Lau; Xuejun Fan, available in PDF.
Download format: PDF (.pdf). Available files can be downloaded from My books immediately after payment is confirmed. We also email you a download link. If your edition needs file preparation, your account shows its pending status; the download and email follow upload and staff approval.
The book focuses on the design, materials, process, fabrication, failure mechanism, reliability, modeling, and thermal management of chiplets and heterogeneous integration. Both…
Catalogue preview, eBooks.com
| Author | John Lau; Xuejun Fan |
|---|---|
| Publisher | Springer Nature Singapore |
| Language | English |
| ISBN | 9789819641659, 9789819641666 |
| Format | |
| Publication date | May 18, 2025 |
| DRM | DRM-free edition available |
| Download format | PDF (.pdf) |
Reviews
There are no reviews yet.